| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0218
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0221
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0425 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R13-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-323
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R4-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B17-64
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R11-01 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R11-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-16 |
| filingDate |
2008-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0cdd8581a8576dd71fe0876a018b4c4a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_52cca6a9292469f4ccf25facefa11b26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cef734ceac173a4338690d767de80a7b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dad8bae74be06b33bc72bba5eb59da65 |
| publicationDate |
2009-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2009231266-A |
| titleOfInvention |
Conductive fine particles, anisotropic conductive material, and connection structure |
| abstract |
An object of the present invention is to provide conductive fine particles capable of reducing a connection resistance value and realizing high connection reliability. Another object of the present invention is to provide an anisotropic conductive material and a connection structure using the conductive fine particles. Conductive fine particles in which a metal layer containing nickel or palladium and a low melting point metal layer containing a low melting point metal and indium are sequentially laminated on the surface of a resin fine particle, The electroconductive fine particles whose content of the indium in the total of metals contained in the metal layer is 0.01 to 6% by weight. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020057612-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012142117-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016042466-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7032481-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012142247-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012142127-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016006764-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020174051-A |
| priorityDate |
2007-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |