http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009215457-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 |
| filingDate | 2008-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cb8d50074cb0ac26449742aa9793860f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22c239c6adb808bda0534a334eca51e8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b74520406984987e5ba7c6aa33b8a72 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_075ead482a6e38dcab704fcb4b36a9fe |
| publicationDate | 2009-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2009215457-A |
| titleOfInvention | Resin composition, prepreg and metal-clad laminate |
| abstract | [Problem] In the manufacturing process of a printed wiring board using lead-free solder, there are few occurrences of problems such as swelling of the substrate, the connection reliability and insulation reliability of the substrate are good, and the punching processability of the substrate Provides a resin composition having a good thickness, and a prepreg and a metal-clad laminate using the resin composition. SOLUTION: A resin composition comprising an epoxy resin blend, a polyfunctional curing agent, and an inorganic filler, wherein the epoxy resin blend is (A) tetrakishydroxyphenylethane type epoxy resin 4-8. (B) 13 to 18% by mass of a polyfunctional epoxy resin having a softening point of 70 ° C. or higher, and (C) a liquid epoxy resin 2 to 8 having a repeating structural unit n = 0. % By weight and (D) containing the remainder of the bromine-containing resin, and the bromine content in the epoxy resin composition is 11.5 to 14.5% by mass, based on 100 parts by mass of the epoxy resin composition The resin composition comprising 28 to 36 parts by mass of the (E) polyfunctional curing agent, and further containing 25 to 35% by mass of the inorganic filler (F) in the resin composition, this resin Prepreg containing composition and metal Tension laminate. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112266576-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150123179-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114539719-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102293385-B1 |
| priorityDate | 2008-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 159.