http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008050566-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 |
| filingDate | 2007-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22c239c6adb808bda0534a334eca51e8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b74520406984987e5ba7c6aa33b8a72 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cb8d50074cb0ac26449742aa9793860f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_075ead482a6e38dcab704fcb4b36a9fe |
| publicationDate | 2008-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2008050566-A |
| titleOfInvention | Resin composition, prepreg, and metal-clad laminate using the prepreg |
| abstract | In a printed wiring board manufacturing process using lead-free solder, a resin composition that is less likely to cause problems such as board blistering and has good connection reliability and insulation reliability of the board, and based on the composition Provided are a prepreg impregnated in a material and a metal-clad laminate using the prepreg. (A) a bifunctional epoxy resin having an epoxy equivalent of 500 or less, (B) a tetrakis (hydroxyphenyl) ethane type epoxy resin, (C) a novolac type epoxy resin, (D) a brominated flame retardant, (E) In the resin composition containing the curing agent and (F) inorganic filler, (B) / (A) (mass ratio) is 0.5 to 2.0, and the resin composition excluding the inorganic filler has a novolak structure. A resin composition having a resin content of 30 to 70% by mass and a bromine content of 11.5 to 14.5% by mass, a prepreg impregnated with the resin composition on a substrate, and a metal using the prepreg It is a tension laminate. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014109027-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009215458-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009215457-A |
| priorityDate | 2006-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 159.