| abstract |
Disclosed is a polishing pad with improved water resistance while polishing, while maintaining high dimensional stability during moisture absorption or water absorption while having high water absorption. An isocyanate-terminated prepolymer A obtained by reacting a prepolymer raw material composition containing a diisocyanate, a high molecular weight polyol a, and a low molecular weight polyol, and an isocyanate modified product obtained by adding three or more diisocyanates. And a high molecular weight polyol b having a number average molecular weight of 1000 to 2000, and a prepolymer raw material composition having an NCOindex (isocyanate group / active hydrogen group equivalent ratio) of 3.5 to 7.0. A reaction cured product of a polyurethane raw material composition containing an isocyanate-terminated prepolymer B and a chain extender, and a polishing layer made of a polyurethane foam having fine bubbles is used. [Selection] Figure 1 |