Photosensitive resin composition, photospacer and method for forming the same, protective film, coloring pattern, substrate for display device, and display device
It is an object of the present invention to improve polymerization curability during exposure and to form a pattern structure or a protective film without a low heating temperature or heat treatment. A photosensitive resin composition comprising a resin, a polymerizable compound having a dipole moment of 3.50 Debye or more, and a photopolymerization initiator. [Selection figure] None