| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_99505f5f312672820e9f78c254c00a4d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-323
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13101
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13109
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01074
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01058
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05572
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01052
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11849
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2982
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01049
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1161
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1152
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11622
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3478
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-07811
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10329
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-114
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01065 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2008-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_71e964bd7f0b829d4a3e4e5da7e2f461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30e3d9c402a5166c36d5acd5b4670727
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4207400eeb550e02f42f78d9276512d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ac8d6feddd008b750eb936f5670ab4a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_785dfd0ca1bdb77ed3e720842d48ad21 |
| publicationDate |
2009-07-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2009152554-A |
| titleOfInvention |
Method for producing a metal tip from a layer containing several elements using a plasma |
| abstract |
A method of manufacturing a flip chip having a desired structural characteristic with a smaller size and a higher density per unit area is provided. A further object advantageously achieved also provides a method for eliminating the photolithography step used in the prior art. The invention relates to a method of manufacturing a chip composed of at least one conductive material. Such a method includes depositing an alloy comprising at least one conductive material and a second material on a support, and a portion of the composition of the chip that is at least the second material that is not the conductive material. Exposing the alloy to plasma etching and forming a chip composed of at least the conductive material to cause desorption of the alloy material that is not formed. [Selection] Figure 4 |
| priorityDate |
2007-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |