| abstract |
Disclosed is a metal particle dispersion liquid that has excellent dispersibility and stability in a dispersion medium, and can be used to reduce the firing temperature by using ultraviolet irradiation in combination with a conductive film such as a wiring or a conductive pattern. Providing a method for producing a metal particle dispersion capable of easily and reliably producing the metal particle dispersion, a method for producing a conductive film-formed substrate excellent in performance and reliability, performance and reliability To provide electronic devices and electronic devices that are superior to each other. A metal particle dispersion of the present invention comprises a compound containing a sulfur atom, a material containing a noble metal material, a metal particle having a particle size of 1 to 100 nm, and a dispersion medium, wherein the metal particle is the above-mentioned metal particle. It is characterized by being encapsulated with a compound. The metal particles are preferably composed mainly of Ag. [Selection figure] None |