| abstract |
(57) Abstract: When forming an electrical conduction path between substrates through an anisotropic conductive material, even when the minimum line width and line interval of a wiring pattern are less than 300 μm, for example. , Provided is an anisotropic conductive material which has a low connection resistance between a metal bump and a wiring and a small variation, while increasing insulation between adjacent wirings. SOLUTION: In a non-conductive thermosetting resin composition, as a conductive medium, metal fine particles having an average particle diameter of 1 to 100 nm, the surface of which can be coordinated with the metal element. As a group, a resin composition containing at least one compound having a group containing nitrogen, oxygen, and sulfur atoms is included, and the resin composition reacts with a compound having a group containing nitrogen, oxygen, and sulfur atoms under heating. A possible organic acid anhydride or a derivative thereof or an anisotropic conductive material containing an organic acid. |