| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1bc9976a81442c6b94ccab8ba654cc28 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48465
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-73
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 |
| filingDate |
2007-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aa078e15f5cff1eafaeff7da9015848f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d6469fac15dc1ff8832e1634f238aac
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e05608c730e79ad0b4963376cd0962df
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5e48a7f87d338decd1a4e8e84f4ad344 |
| publicationDate |
2009-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2009065092-A |
| titleOfInvention |
Adhesive composition and semiconductor device using the same |
| abstract |
An adhesive composition that enables connection of semiconductor elements by wire bonding using ultrasonic waves at room temperature, and a semiconductor device using such an adhesive composition are provided. An adhesive composition used for bonding a semiconductor element having an electrode to be electrically connected by an ultrasonic wire bonding method on a semiconductor element support member, the adhesive composition being cured at 25 ° C. Adhesive composition having a tensile modulus of elasticity of 0.1 to 4.0 GPa and a die shear strength of 10 MPa or more, and a semiconductor element bonded to a semiconductor element support member with such a composition. This is a semiconductor device. [Selection figure] None |
| priorityDate |
2007-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |