| abstract |
An object of the present invention is to provide a method of manufacturing a semiconductor device capable of reducing the thickness of a support substrate and realizing a small and thin package suitable for mounting a fine semiconductor chip. A supporting substrate is formed by integrating two conductive foils and a thermoplastic resin film disposed therebetween by thermocompression bonding, and at the time of thermocompression, the conductive material is also formed of a thermoplastic resin film. A conductive material 57 is formed to penetrate through 51 and electrically connect both conductive foils 52 and 53 without a via hole. Also, the heating step of the bonding wire 61 can be omitted by wedge bonding, and the height of the loop can be greatly reduced. As a result, an extremely thin mounting structure can be realized with a simple structure, and a semiconductor device manufacturing method most suitable for mounting a micro semiconductor chip is realized. |