http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009046606-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2007-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3bca032d9934bef843d7496e66561469 |
| publicationDate | 2009-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2009046606-A |
| titleOfInvention | Thermosetting liquid encapsulating resin composition and semiconductor device |
| abstract | An object of the present invention is to provide a thermosetting liquid resin composition for encapsulating a semiconductor that satisfies both good workability and electrical reliability, and a semiconductor device using the same. In particular, the sealing process time can be shortened and the yield can be improved, and it is used for sealing a semiconductor device having a narrow gap and a narrow pitch. In a thermosetting liquid sealing resin composition comprising (A) a thermosetting liquid resin, (B) a curing agent, and (C) an organic dye as essential components, the organic dye is preliminarily cured with the thermosetting. A thermosetting liquid resin composition, which is dissolved in a curable liquid resin and / or the curing agent. [Selection figure] None |
| priorityDate | 2007-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 52.