| abstract |
To provide an epoxy resin molding material for sealing excellent in insulation reliability, and an electronic component device that is less likely to cause defective electrical characteristics and is excellent in appearance and laser mark properties such as YAG. A sealing epoxy resin molding material comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) a colorant, and (E) an inorganic filler as essential components. , (D) a sealing epoxy resin in which the colorant contains two or more selected from black organic pigments, phthalocyanine compounds and titanium black pigments in an amount of 0.01 to 1.0% by weight with respect to the molding material, respectively. Molding material. [Selection figure] None |