Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31116 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31122 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31144 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3213 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 |
filingDate |
2008-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_54da297c75cf50634cd2b78feb9a1272 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cd44b6a5ee8133bc567dee4402c72c87 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2fd2133cfc4bab2ebcab74f289488432 |
publicationDate |
2009-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2009021605-A |
titleOfInvention |
Etching method using advanced patterning film in capacitively coupled high frequency plasma dielectric etching chamber |
abstract |
A method of etching a wafer using an advanced patterning film (APF) to reduce curvature and improve the down / up ratio. A wafer having an APF layer is placed in a processing chamber having a power source operating at about 162 MHz, a processing gas is supplied to the chamber, source power is applied using a 162 MHz power source, and bias power is applied to the wafer. Including applying. The processing gas includes hydrogen gas (H 2 ), nitrogen gas (N 2 ), and carbon monoxide gas (CO). The ratio of H 2 : N 2 is about 1: 1. In addition, the wafer temperature is adjusted to improve the etching characteristics. [Selection] Figure 1 |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101731669-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013232501-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9248693-B2 |
priorityDate |
2007-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |