http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009019225-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9ec030fc062b270c25327af9127bed3a |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-38 |
| filingDate | 2007-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_25236d3555167745c3876ade6b29f9d1 |
| publicationDate | 2009-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2009019225-A |
| titleOfInvention | Electroless copper plating solution and electroless copper plating method |
| abstract | [PROBLEMS] To solve the problems of conventional electroless copper plating solutions that tend to protrude from a nickel film and form a copper film and have poor liquid stability. An electroless copper plating solution for forming a copper film on a nickel film by a substitution reaction with nickel metal, wherein the electroless copper plating liquid does not contain a copper reducing agent, and A copper complexing agent that relaxes the substitution reaction is contained. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016069676-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015076549-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9888585-B2 |
| priorityDate | 2007-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 39.