| abstract |
The present application relates to a polishing pad for chemical mechanical planarization (CMP) of a substrate, and methods for processing and using the same. The pads described in the present invention are customized to polishing specifications, which include materials to be polished, chip design and architecture, chip density and pattern density, equipment platform, and the type of slurry used. But not limited to these). These pads can be designed with special polymer nanostructures with long-range or short-range order that allow molecular level tuning to achieve excellent thermomechanical properties. More specifically, the pad can be designed and processed so that there is both a uniform and non-uniform spatial distribution of chemical and physical properties within the pad. |