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filingDate 2003-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2004-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004337992-A
titleOfInvention Fixed abrasive polishing pad and method for polishing silicon wafer using fixed abrasive polishing pad
abstract An object of the present invention is to provide a fixed abrasive polishing pad and a method for polishing a silicon wafer using the fixed abrasive polishing pad, which prevent removal of abrasive grains and improve polishing efficiency. A fixed abrasive polishing pad for pressing a silicon wafer and polishing the silicon wafer by a relative movement with the silicon wafer while supplying an alkaline solution as a polishing liquid between the silicon wafer and the fixed abrasive. The grain polishing pad is composed of a polyurethane binder comprising at least a hard segment and a soft segment and abrasive grains having a hydroxyl group, or abrasive grains having a hydroxyl group. % To 60% or less. [Selection] Figure 2
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