Electromigration resistant and flexible wire interconnects, nano-sized solder compositions, systems for forming them, and methods for assembling soldered packages
The data transmission module includes a connector that is received and connected to a backplane in the modular platform. The data transmission module also includes other connectors that are flush with the board when received and connected in a slot in the board. The data transmission module further includes one or more data transmission interfaces for exchanging data between the board and the backplane via the connector. [Selection figure] None