http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004172612-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be92719b856db86c092cc233e9512ca2 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2003-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e4090402810066c20c2110170fe5264 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0acb0b2b2e189db29af182a1c3520252 |
| publicationDate | 2004-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2004172612-A |
| titleOfInvention | Semiconductor device having micro-diameter bump, bump formation by ink jet method, and ink composition used therefor |
| abstract | PROBLEM TO BE SOLVED: To provide a semiconductor element in which a solder bump having a small diameter, which has been sufficiently impossible to form in the prior art, is sufficiently satisfied with a function expected of a solder bump. Moreover, the subject of this invention is providing the semiconductor element in which the solder bump with few voids or a crack was formed. Another object of the present invention is to provide a semiconductor element on which solder bumps are formed that do not cause separation from an intermediate metal layer or a pad. Furthermore, it is providing the solder bump formation method which can shorten working time significantly, and the ink composition for solder bump formation used therefor. A semiconductor element in which an intermediate metal layer and a bump are sequentially provided on an external electrode pad, wherein the bump has a diameter of 30 μm or less. [Selection] Figure 8 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8441118-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4556568-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4918088-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017520907-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006074587-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100610273-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100845505-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008545257-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7754597-B2 |
| priorityDate | 2002-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 167.