| Predicate |
Object |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0236
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0226
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0048 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-022 |
| filingDate |
2006-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2008-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2008529080-A |
| titleOfInvention |
Positive dry film photoresist and composition for producing the same |
| abstract |
The positive photoresist resin film of the present invention includes a support film and a positive photoresist resin layer laminated on the support film. The photoresist resin layer has a sufficiently high boiling point such that the second solvent can be effectively removed from the composition by heating while substantially maintained in the composition, the resin, the photosensitive compound. And a first solvent having the composition. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2018070489-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018070489-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20220016025-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012512305-A |
| priorityDate |
2005-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |