| abstract |
A photosensitive compound capable of forming an ultrafine photoresist pattern and a photoresist composition containing the same are provided. [Solution] As shown in the following reaction process formula 3, the photosensitive compound has a structure represented by the following chemical formula. In the above chemical formula, x is a constant of 1 to 5, y is a constant of 2 to 6, and R is a hydrocarbon group having 2 to 20 carbon atoms. The photoresist composition reacts with 1 to 85% by weight of the photosensitive compound having the structure of the chemical formula and a hydroxyl group (—OH) of the compound represented by the chemical formula to bond with the photosensitive compound represented by the chemical formula. 1 to 55% by weight of compound, 1 to 15% by weight of photoacid generator, and 12 to 97% by weight of organic solvent. [Selection figure] None |