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filingDate 2007-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2008-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2008294016-A
titleOfInvention Ceramic substrate and semiconductor manufacturing apparatus equipped with the same
abstract PROBLEM TO BE SOLVED: To provide a ceramic substrate, particularly a shower substrate, for a semiconductor manufacturing apparatus having a greatly improved electrode connection structure so that the throughput of a semiconductor process can be improved. A ceramic substrate 1 is installed in a chamber of a semiconductor manufacturing apparatus and has a conductor 2 embedded therein, an electrode member 3 for connecting an external terminal connected to the conductor 2, and an electrode member 3. A conductive cover member 4 that is connected and covers the electrode member 3, and an O-ring 5 that shields the electrode member 3 covered with the cover member 4 from the atmosphere in the chamber. The electrode member 3 and the ceramic substrate 1 and the electrode member 3 and the cover member 4 are mechanically connected by screws or the like. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020184640-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018190218-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7099495-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009188396-A
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