| abstract |
The present invention provides good adhesion to noble metals such as Ag and Au, good reflow resistance, and good flame retardancy without reducing reliability such as moldability, moisture resistance, and high-temperature storage properties. Provided are an epoxy resin composition for sealing, and an electronic component device including an element sealed thereby. An encapsulating epoxy resin composition containing (A) an epoxy resin, (B) a curing agent, (C) 4,4′-dithiodimorpholine represented by the following formula (I): (C) The epoxy resin composition for sealing, wherein the content of 4,4′-dithiodimorpholine is 0.10 to 1.00% by weight based on the total weight of the epoxy resin composition for sealing object. [Selection figure] None |