http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004137397-A

Outgoing Links

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filingDate 2002-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22d29688f8322526c987c2c514d2c5c0
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publicationDate 2004-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2004137397-A
titleOfInvention Resin composition and electronic component device
abstract An object of the present invention is to provide a sealing material exhibiting excellent adhesion to a surface layer coated with a metal material such as copper, silver, gold, and gold / palladium. The phenolic disulfide compound represented by the general formula (21), (B) an epoxy resin, (C) a curing agent, and (D) an inorganic filler are essential components. A resin composition comprising a disulfide compound in an amount of 0.1 to 15% by weight based on an epoxy resin. Embedded image [Selection diagram] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008174711-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010083956-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7321778-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014196436-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10851261-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008239983-A
priorityDate 2002-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 29.