| abstract |
PROBLEM TO BE SOLVED: To provide a polishing pad for performing flattening processing of a material requiring high surface flatness such as a silicon wafer, a magnetic disk, and an optical lens for a semiconductor device stably and at a high polishing rate. Easily produce sheets, surface processing such as grooves, etc., provide a polishing pad with excellent thickness accuracy, high polishing speed, and uniform polishing speed, no variation in quality due to individual differences, change processing pattern It is easy to perform, fine processing is possible, it is a polishing pad that does not generate burrs when forming irregularities, slurry-free, abrasive grains can be mixed at high concentration, and even if dispersed, abrasive grains agglomerate A polishing pad with less generation of scratches due to the above is provided. A polishing layer is formed of a curable composition that is cured by energy rays, and the polishing layer is a polishing pad having a concavo-convex surface formed by a photolithography method. The polishing layer resin in which the abrasive grains are dispersed is a polishing pad that is a resin having an ionic group of 20 to 1500 eq / ton. [Selection] Figure 1 |