http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008187104-A

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filingDate 2007-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f852af4610a4d18960afc26053b222da
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publicationDate 2008-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2008187104-A
titleOfInvention Substrate processing method and substrate processing apparatus
abstract Provided is a substrate processing method capable of selectively removing deposits generated in dry etching of silicon. A wafer W having a silicon substrate 40, a silicon nitride film 41 formed on the silicon substrate, and a hard mask 42 formed on the silicon nitride film 41 is generated from hydrogen bromide gas. The plasma 44 is dry etched to etch the silicon substrate 40 to form the trench 45, heat the wafer W to 200 ° C. or higher, and supply the hydrogen fluoride gas 31 and helium gas toward the wafer W. Then, oxygen radicals 32 are supplied into the trench 45 of the wafer W, dry etching is performed again on the wafer W by the plasma 44 to etch the silicon substrate 40, and the depth of the formed trench 45 is greater than a desired value. If it is larger, the process is terminated. [Selection] Figure 2
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