abstract |
A resin component (A) that is soluble in an alkali developer by the action of an acid and a compound (B) that generates an acid in response to an actinic ray or radiation, the resin component (A) comprising: A positive resist material, which is a polymer compound having a repeating unit represented by the following general formula (1) and the compound (B) that generates an acid is a sulfonium salt compound represented by the following general formula (2). (R 1 is H, a methyl group, or a trifluoromethyl group. R 2 is an acid labile group. R 3 is H or CO 2 R 4. R 4 is a monovalent hydrocarbon group. X is O, S, CH 2. Or CH 2 CH 2, m is 1 or 2. n is 1 or 2. a, b, c, and d are each 0.01 or more and less than 1, and a + b + c + d = 1.) (R 5 , R 6 and R 7 are H or a monovalent hydrocarbon group. R 8 is a monovalent hydrocarbon group.) The resist material of the present invention has a very high resolution in a microfabrication technique, particularly ArF lithography technique, and can give a pattern with a small line edge roughness. [Selection figure] None |