http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008108787-A

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filingDate 2006-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2008-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2008108787-A
titleOfInvention Nonvolatile semiconductor memory device and manufacturing method thereof
abstract PROBLEM TO BE SOLVED: To increase the number of steps that a silicon oxide film formed on a side wall of a tungsten silicide film is swelled more than a silicon oxide film formed on a side wall of a polycrystalline silicon film at the time of gate electrode side wall oxidation. Prevent without. SOLUTION: Under a mixed gas condition of pressure 4 to 10 mmTorr, RF source power 200 to 400 W, bias power 100 to 200 W, CF 4 / Cl 2 / N 2 , the flow rate of CF 4 gas is 1 to 50 sccm, Cl 2 gas. The tungsten silicide film 6 is etched by setting the flow rate of 100 to 150 sccm and the flow rate of N 2 gas to 7 sccm or less, and the tungsten silicide film 6 is processed into a constricted shape in advance. However, even if more is oxidized than the first polycrystalline silicon film 3 and the second polycrystalline silicon film 5, a desired gate electrode shape can be obtained. [Selection] Figure 1
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