http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008027830-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be055db3c1a09879df07379ba969e223
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05H1-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B08B7-00
filingDate 2006-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0f6d57b46a908981d2fda30186b2e2aa
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publicationDate 2008-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2008027830-A
titleOfInvention Plasma processing method and apparatus
abstract Only a processing portion of an object to be processed is processed stably and efficiently with a simple configuration and control with high productivity and low cost. A first inert gas 15 is supplied to a reaction space 11 provided in a plasma head 10 and a high-frequency electric field is applied to blow out a primary plasma 16 from the reaction space 11 so that a second inert gas is mainly used. A mixed gas region 20 in which an appropriate amount of reactive gas is mixed is formed in or near the plasma head 10 and the secondary plasma 21 is generated by colliding the primary plasma 16 against the mixed gas region 20 to generate the secondary A plasma processing method in which a plasma 21 is sprayed onto a processing location of the object 5 to be processed, and the primary plasma 16 is continuously generated when the plasma head 10 and the object 5 are moved relative to each other to process the processing location. Thus, the mixed gas region 20 is formed only at the processing portion to generate the secondary plasma 21. [Selection] Figure 3
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Total number of triples: 49.