abstract |
In the present invention, a method and apparatus for depositing a low temperature inorganic film on a large area plastic substrate is described. The low temperature (<80 ° C.) inorganic film hardly adheres to the plastic substrate. Therefore, a low temperature (<80 ° C.) plasma pretreatment is added to improve adhesion. The plasma pretreated inorganic film exhibits good adhesion and airtightness. [Selection] Figure 5 |