http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007502547-A

Outgoing Links

Predicate Object
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31122
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
classificationIPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05H1-46
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05H1-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-324
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-336
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
filingDate 2004-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2007-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007502547-A
titleOfInvention Method and system for etching a HIGH-K dielectric material.
abstract A method and system for etching a HIGH-K dielectric material. A method of heating a substrate between a first process and a second process using plasma is described. This heating method comprises thermally isolating the substrate on the substrate holder by removing the backside supply of heat transfer gas and removing the clamping force. Furthermore, an inert gas such as a noble gas is introduced into the plasma processing system and the plasma is ignited. The substrate is exposed to an inert plasma for a period of time sufficient to raise the temperature of the substrate from a first temperature (ie, typically less than 100 ° C.) to a second temperature (ie, typically on the order of 400 ° C.). It is. [Selection]
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014099659-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017046010-A
priorityDate 2003-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24261
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID457707758

Total number of triples: 21.