http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007294487-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7acd9416af412b5972feb55a5e652ea2
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B5-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
filingDate 2006-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7537b2ab010c86f634853f5f4636dcfd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3397eef519b42a73434c8a4fc25b4907
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publicationDate 2007-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007294487-A
titleOfInvention Manufacturing method of prepreg and printed wiring board
abstract A prepreg capable of easily manufacturing a printed wiring board excellent in all aspects of rigidity, plating peel strength, and insulation reliability is provided. The present invention relates to a prepreg 3 produced by impregnating a fibrous base material 2 with a resin composition 1 and then drying. As the resin composition 1, one prepared by blending a component that is easily dissolved in a roughening solution containing both or one of an acid and an oxidizing agent and a resin that is a component that is difficult to dissolve in the roughening solution is used. . As the fibrous base material 2, one having a thickness of less than 0.1 mm is used. The resin content is 60 to 90% by mass relative to the total amount of prepreg 3. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9351397-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013115069-A1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013187380-A
priorityDate 2006-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 32.