| abstract |
(57) [Problem] To provide a prepreg capable of enhancing the adhesion strength of copper foil in an insulating layer made of a para-aramid non-woven fabric as a base material and contributing to further improvement of component mounting reliability, and an inner layer circuit using the same. Provide a laminate. SOLUTION: A para-aramid nonwoven fabric having a porosity of 30 to 55% is used as a base material, and an epoxy resin, a curing agent, In a prepreg impregnated with an epoxy resin composition varnish containing an epoxy resin composition containing a curing accelerator and semi-cured, an outer layer copper foil directly laminated on the prepreg of a laminated board containing an inner circuit using the same is used. As a result, sufficient copper foil adhesion strength can be ensured stably, and as a result, it can contribute to improvement in component mounting reliability. |