| abstract |
An object of the present invention is to provide a cleaning agent for copper wiring, which has an excellent copper wiring corrosion inhibition effect (copper corrosion inhibition effect) and does not affect the contact resistance. A copper wiring comprising a copper corrosion inhibitor (RE) and water (W), having a pH of 3 to 14 at 25 ° C., and satisfying the formula (1). Use cleaning agent. [Expression 1] {In the formula, E represents an oxidation-reduction potential (V, vsSHE) at 25 ° C, and pH represents a pH at 25 ° C. } Also, the semiconductor substrate or the semiconductor element cleaning is characterized by cleaning the semiconductor substrate or the semiconductor element having the copper wiring by continuously or intermittently supplying the copper wiring cleaning agent to the semiconductor substrate or the semiconductor element. Use the method. [Selection] None |