| abstract |
An object is to provide a method for manufacturing a semiconductor device with high yield without damaging a stacked body. In addition, a method for manufacturing a thin, lightweight, and flexible semiconductor device with high yield is provided. A photocatalyst layer and an organic compound layer in contact with the photocatalyst layer are formed on a light-transmitting substrate, and an element is formed on the light-transmitting substrate through the photocatalyst layer and the organic compound layer in contact with the photocatalyst layer. This is a method for manufacturing a semiconductor device in which a layer is formed, light is applied to a photocatalyst layer through a light-transmitting substrate, and then an element formation layer is separated from the light-transmitting substrate. [Selection] Figure 1 |