| abstract |
A novel photoresist suitable for extreme ultraviolet (EUV) exposure. Several low molecular weight glasses having a novel structure designed for use as a photoresist in semiconductor lithography are used. The photoresist is a low molecular weight organic material that exhibits a glass transition temperature significantly higher than room temperature and a tendency to hardly crystallize. The molecular glass photoresist has a tetrahedral silane molecular nucleus with four phenyl groups or four biphenyl groups. Each phenyl group or each outer phenyl group of the biphenyl group has a methoxy group or a hydroxy group at the 3-position or 4-position. For the biphenyl embodiment, the linkage can be meta-meta, meta-para, para-para, or para-meta. [Selection figure] None |