Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01046 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15787 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01074 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
filingDate |
2006-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2c071f66f7ef6e4b973b97b23947f201 |
publicationDate |
2007-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2007234656-A |
titleOfInvention |
Manufacturing method of ceramic generation form for multiple-taken wiring board, manufacturing method of multiple-taken wiring board, electronic component storage package, and electronic device |
abstract |
A method of manufacturing a multi-cavity wiring board in which deformation of a recess in each wiring board region of the multi-cavity wiring board is reduced is provided. A plurality of wiring board regions 7 are arranged vertically and horizontally, the plurality of wiring board regions 7 have recesses 4, and at least part of the holes around the recesses 4 are located in the wiring board regions 7. A step of preparing a ceramic generating shape 5 in which 2 is disposed, and a notch 6 for dividing grooves is formed on the hole 2 of the ceramic generating shape 5 or outside the hole 2 with respect to the recess 4 The process of carrying out. [Selection] Figure 1 |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010153423-A |
priorityDate |
2006-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |