http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007234656-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a8faea375370b67c9d71e67db32bcd
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15787
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01074
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
filingDate 2006-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2c071f66f7ef6e4b973b97b23947f201
publicationDate 2007-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007234656-A
titleOfInvention Manufacturing method of ceramic generation form for multiple-taken wiring board, manufacturing method of multiple-taken wiring board, electronic component storage package, and electronic device
abstract A method of manufacturing a multi-cavity wiring board in which deformation of a recess in each wiring board region of the multi-cavity wiring board is reduced is provided. A plurality of wiring board regions 7 are arranged vertically and horizontally, the plurality of wiring board regions 7 have recesses 4, and at least part of the holes around the recesses 4 are located in the wiring board regions 7. A step of preparing a ceramic generating shape 5 in which 2 is disposed, and a notch 6 for dividing grooves is formed on the hole 2 of the ceramic generating shape 5 or outside the hole 2 with respect to the recess 4 The process of carrying out. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010153423-A
priorityDate 2006-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006041269-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004349564-A
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID17100
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419519470

Total number of triples: 33.