| abstract |
An apparatus and method for forming a coating at an intermediate pressure of 5 to 150 Torr. Until the radicals generated in the discharge space reach the substrate surface, the discharge space is shielded with a purge gas so as not to be affected by the surrounding atmosphere. By applying a magnetic field and a bias voltage to the plasma, the radicals easily reach the substrate surface, and the reached radicals promote a film forming reaction on the substrate surface. [Selection] Figure 1 |