| abstract |
A positive resist composition used in a semiconductor manufacturing process such as an IC, a circuit board such as a liquid crystal or a thermal head, and other photofabrication processes, and pattern formation using the positive resist composition A positive resist composition capable of coexisting in a high dimension with respect to line edge roughness (LER), exposure latitude (EL), PEB temperature dependence and pattern collapse, and a method using the positive resist composition A pattern forming method is provided. (A) A resin containing a repeating unit (A1) having a lactone structure and a cyano group and having increased solubility in an alkaline developer by the action of an acid, and (B) generating an acid upon irradiation with actinic rays or radiation. And (C) a positive resist composition containing a solvent and a pattern forming method using the positive resist composition. [Selection figure] None |