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filingDate 2006-12-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2007-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007123922-A
titleOfInvention Polishing method
abstract A method of polishing a substrate capable of polishing a surface to be polished such as a SiO 2 insulating film at a high speed without damage. A polishing method for polishing a substrate using an abrasive containing a slurry in which cerium oxide particles including cerium oxide particles having a crystal grain boundary and composed of two or more crystallites are dispersed in a medium. In this method, the grain boundary of the cerium oxide particles is broken by the stress of time to generate a new surface. [Selection figure] None
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