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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
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filingDate 2005-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1a5013b97dc520e7a9178c9334a94d1a
publicationDate 2007-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007101863-A
titleOfInvention Photosensitive resin composition, photosensitive element, method for producing resist pattern, and method for producing printed wiring board
abstract A photosensitive resin composition having high sensitivity and excellent resolution, adhesion, and mandrel characteristics (resist flexibility after curing), a photosensitive element using the same, a method for producing a resist pattern, and a printed wiring board It is to provide a manufacturing method. SOLUTION: (A) Binder polymer, (B) Ethylenically unsaturated photopolymerizable monomer, (C) Photopolymerization initiator and sensitizer, (D) Plasticizer, main skeleton is (B) ethylenic A photosensitive resin composition comprising an unreactive (saturated) compound having the same or similar to an unsaturated photopolymerizable monomer and a derivative thereof. [Selection figure] None
priorityDate 2005-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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