| abstract |
Disclosed is a metal film CMP slurry capable of stably polishing a metal film with low friction and uniformity without causing defects in the metal film or insulating film. SOLUTION: Water, polyvinylpyrrolidone having a weight average molecular weight exceeding 200,000, an oxidizing agent, a first metal compound forming agent that forms a water-insoluble metal compound, and a second metal compound forming agent that forms a water-soluble metal compound An aqueous dispersion for chemical mechanical polishing, comprising a protective film-forming agent and abrasive grains. [Selection figure] None |