| abstract |
PROBLEM TO BE SOLVED: To provide an adhesive composition for a semiconductor device and an adhesive sheet for a semiconductor device, which have various excellent characteristics, in particular, excellent adhesive strength and heat deterioration resistance. A vinyl having an epoxy resin (A), a phenol resin (B), ethylene as a monomer component, and an unsaturated carboxylic acid having a functional group capable of reacting with the epoxy resin (A) or a derivative thereof. Copolymer (C), and has a minimum melt viscosity of 400 to 50000 Pa. In dynamic viscoelasticity measurement before curing. It is in the range of s, The adhesive composition for semiconductor devices characterized by the above-mentioned. [Selection figure] None |