| abstract |
Provided is an adhesive composition for a semiconductor device which has a low moisture absorption rate, has excellent moisture absorption reflow resistance, and particularly has excellent crack resistance. The adhesive composition for a semiconductor device comprises (A) an epoxy compound or epoxy resin having two or more functional groups and (B) a curing agent in which 10 mol% to 100 mol% of hydroxyl groups are esterified with a carboxylic acid. A composition comprising, as essential components, a bifunctional or more functional ester group-containing compound or ester group-containing resin and (C) a curing accelerator comprising a compound having a specific structure. Further, (F) an ethylene-acrylic elastomer, (G) an epoxy group-containing acrylic having a Tg (glass transition temperature) of -50 ° C or more, a weight average molecular weight of 100,000 or more, and containing 2 to 6% by weight of glycidyl (meth) acrylate. It is preferable to contain other thermoplastic resins such as a system copolymer and (H) a silicone-modified polyimide. [Selection diagram] None |