http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006507667-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
filingDate 2003-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2006-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2006507667-A
titleOfInvention System and method for removing material
abstract As described above, embodiments of the present invention provide for removal of process material crusts such as photoresist ion implanted from a process target. The halogen-free plasma is generated by using a hydrocarbon gas in combination with oxygen gas so that the crust is subjected to the plasma. Methane can be used as a hydrocarbon gas. This plasma may be used to remove the underlying native photoresist and residues associated with ion implantation. The plasma can also be generated by using a gas containing hydrogen, which may be pure hydrogen gas, in combination with oxygen gas. Several techniques are used that involve exposing a workpiece to a hydrogen / oxygen based plasma followed by a hydrocarbon / oxygen based plasma.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011243595-A
priorityDate 2002-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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