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filingDate 2005-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2006-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2006286929-A
titleOfInvention Manufacturing method of resin film holding substrate and use thereof
abstract PROBLEM TO BE SOLVED: To obtain a resin film holding substrate having a sufficient contrast in the wettability of a liquid conductive material between a partition member and a substrate without deteriorating the partition member, and to form a fine pattern by an inkjet method in a pattern concave portion of the substrate To provide a method for manufacturing a circuit board for an electronic device that can realize an appropriate wiring formation. SOLUTION: After forming a patterned resin film 2 on a substrate 1, the surface of the resin film is exposed to a fluorine gas atmosphere, and then an alkaline solution is brought into contact with the surface having the resin film. The above problem is solved by the method for producing a resin film holding substrate. In particular, the alkaline solution is preferably a 0.1 to 5% by weight tetramethylammonium hydroxide aqueous solution. [Selection] Figure 1
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