http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006237435-A

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filingDate 2005-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2006-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2006237435-A
titleOfInvention Group III nitride compound semiconductor laser manufacturing method
abstract 【Task】 Provided is a method for manufacturing a Group III nitride compound semiconductor laser in which the ohmic characteristics of an electrode are improved by suppressing damage at the interface between the p-electrode and the p-type contact layer and the remaining mask material. [Solution] In the method of manufacturing a group III nitride compound semiconductor laser, a step of forming a plurality of semiconductor layers made of a group III nitride compound semiconductor on a substrate, and a surface of the semiconductor layer having a narrower width than the semiconductor layer. And a step of etching the semiconductor layer using the electrode as a mask to form a ridge portion. Since the surface of the electrode is made of a metal that is not easily affected by etching, the influence of the p-electrode due to plasma damage or etching gas corrosion is reduced. [Selection] Figure 1
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Total number of triples: 22.