| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f4a752bdf448f5e53cc112f200930037 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K2200-0657
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K2200-0239 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1009
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L27-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L27-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F16J15-10 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-205 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L27-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F16J15-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-10 |
| filingDate |
2005-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd51fefa19cb59b9aae764be6e83dbaf |
| publicationDate |
2006-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2006228805-A |
| titleOfInvention |
Sealant for semiconductor manufacturing equipment |
| abstract |
SOLUTION As a rubber component, 80 to 50% by weight of perfluoroelastomer-perfluoroalkyl vinyl ether-based perfluoroelastomer (FFKM) and 20 to 50% by weight of fluoro rubber (FKM) other than FFKM (provided that FFKM + FKM = 100) And a sealing material for semiconductor manufacturing equipment. [Effect] Excellent resistance to plasma cracks, etc. When used as a sealing material for parts that are directly or indirectly exposed to plasma generated in semiconductor manufacturing equipment, the weight reduction rate of the sealing material is small. There is provided a sealing material that is difficult to crack in the sealing material, has a small compression set, has a good balance of these characteristics, and can be suitably used as a sealing material for a semiconductor manufacturing apparatus. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010113951-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8450423-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8349965-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102365326-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015174988-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100894110-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2824144-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021065199-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5413455-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014118510-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2021065199-A1 |
| priorityDate |
2005-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |