| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_03d0f52bb4069f8a19d70dcfb697c67a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0236
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0237
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-265 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0237
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-387
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-28 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20 |
| filingDate |
2005-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3b007f5906bc3a65385b3ce1eccb1352
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_430cecec3a87d6d06ecfe61026e7a132 |
| publicationDate |
2006-07-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2006193780-A |
| titleOfInvention |
Metal film and method for forming metal film |
| abstract |
The present invention provides a metal film forming method capable of forming a metal film having excellent adhesion to a base material and having less irregularities at the interface with a substrate by a simple process. A polymer layer is obtained by directly chemically bonding a polymer having a functional group that interacts with an electroless plating catalyst or a precursor thereof on a substrate having a surface irregularity of 500 nm or less. A metal film provided by applying electroless plating catalyst or a precursor thereof to electroless plating, and the adhesion between the substrate and the metal film is 0.2 kN / m or more. (A) a functional group that interacts with an electroless plating catalyst or a precursor thereof on a substrate having a surface irregularity of 500 nm or less and is directly chemically bonded to the substrate. A method for forming a metal film, comprising: a step of introducing a polymer; (b) a step of applying an electroless plating catalyst or a precursor thereof to the polymer; and (c) a step of performing electroless plating. . [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10021789-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008106345-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009263707-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009084540-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009263703-A |
| priorityDate |
2005-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |