abstract |
An object of the present invention is to provide a chemical useful for a mask material in the micromachine field having excellent characteristics such as high resolution and high sensitivity, or a plating mold in the micromachine field, semiconductor package, and printed circuit board field. An object is to provide an amplified positive resist composition. The present invention relates to (A) a general formula (I). [Wherein R 1 , R 2 and R 3 are the same or different and each represents substituted or unsubstituted alkyl, substituted or unsubstituted aryl, etc., X represents O or NR (wherein R represents hydrogen And a polymer that generates an acid upon irradiation with radiation (representing atom, substituted or unsubstituted alkyl, substituted or unsubstituted aryl, or substituted or unsubstituted aralkyl) And (C) a chemically amplified positive resist composition for forming a resist having a thickness of 5 to 150 μm, comprising an organic solvent. [Selection figure] None |