| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73ebc284a55d5daf0e209d6186c9e65c |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49401
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-1056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2002-043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-42 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1634
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1628
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1623
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1646
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1645
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1642
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-16 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B41J2-16 |
| filingDate |
2004-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8c17e9d245ee963d89b31b610a8720e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c4d4eeb56f0523d9f45170861b1a1cce |
| publicationDate |
2006-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2006159661-A |
| titleOfInvention |
Droplet discharge head manufacturing method, droplet discharge head, and droplet discharge apparatus |
| abstract |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a droplet discharge head having a high yield without causing a silicon substrate to be cracked or chipped during manufacture. A step of forming a recess to be a nozzle 8 by etching one surface of a silicon substrate 30 and a support substrate 40 are bonded to the surface of the silicon substrate 30 on which the recess to be a nozzle 8 is formed. A step of thinning the silicon substrate 30 from a surface opposite to the surface of the silicon substrate 30 to which the support substrate 40 is bonded, and a step of peeling the support substrate 40 from the silicon substrate 30 after thinning the silicon substrate. It has. [Selection] Figure 1 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8746846-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016055475-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8714708-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012206419-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100735992-B1 |
| priorityDate |
2004-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |